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Thermal Simulation Model for Electronic Device onboard Chinese Space Station

Mincheng Xin, Hanxun Zhang, Ying Liu, Yu Zhang, Peng Yang

Abstract


Thermal simulation analysis related to electronic device onboard spacecraft is not accurate,a method through the case temperature data of hot components obtained from thermal balance test to verify the results of thermal simulation is proposed in this paper. Through in-depth research on actual in-orbit thermal working condition about electronic device of the space engineering project, considering the electronic device physical and electrical property, using the computer applied technology and the digital simulation technology, built the electronic device's thermal model and thermal simulation analysis is carried out to ensure the suitability and effectiveness of thermal design about electronic device.After the two sets of case temperature data obtained from thermal simulation analysis and thermal balance test are analyzed and compared, the results of thermal simulation analysis are proved to be relatively accurate.We draw the conclusion that this method can be applied to the development of electronic devices onboard Chinese Space Station in future,and can improve the accuracy of thermal design for electronic devices with long life, high reliability requirements.

Keywords


Space Station, electronic device, thermal analysis, thermal simulation.

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